India’s Semicon Mission 2.0 (ISM 2.0) is set to prioritise memory chip manufacturing, especially High Bandwidth Memory (HBM), as part of its strategy to strengthen its position in the global semiconductor value chain. The move reflects a shift toward high-value, advanced semiconductor technologies critical for next-generation computing.
HBM is a key component for AI data centres, high-performance computing, and advanced electronics, with global demand surging due to the rapid growth of AI infrastructure. India aims to enter this segment by encouraging investments and building capabilities in advanced memory packaging and production.
The second phase of the semiconductor mission will also focus on building a complete ecosystem, including design, materials, equipment, and R&D, while prioritising proposals related to memory chip production to accelerate technological capability and reduce dependency on global suppliers.
Why This Matters
• Positions India in high-value semiconductor segments like memory chips
• Supports growth of AI, data centres, and high-performance computing
• Reduces reliance on global semiconductor supply chains
• Strengthens India’s ambition to become a global semiconductor hub